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⠶ 創新迭代・世代共融 ⠶Passive Component Application Pastes
Passive Component Application Pastes
PANCOLOUR INK Advantages
Application Scope
Inner Silver Paste
Application
Co-fired ceramic components such as MLCI and LTCC can realize fine lines or large-area graphics, and can also change different silver film thicknesses according to electrical requirements.
Advantage
By adjusting the formula, it can have good sintering shrinkage matching and co-firing characteristics with various green sheet to achieve good electrical properties.
After sintering, extremely slight silver diffusion phenomenon.
Excellent resistance to high humidity and high temperature.
Manufacturing Process
Solvent type screen printing
It has good thixotropy and is suitable for printing with fine line width ≧25μm, with uniform line width and no burrs.
It has good fluidity and is suitable for thin and large-area printing. After sintering, the thickness of the silver layer is thin ≧4μm and uniform. The film surface is complete and free of holes after sintering.
Solvent-free UV light-curing type screen printing
There are no VOCs problems during use. The fast and low-cost UV light irradiation drying process protects the health of operators.
It has good thixotropy and is suitable for silver line thickness ≦20μm, fine line width printing ≧25μm, uniform line width without burrs, and stable printing line performance.
It has good fluidity and is suitable for printing large-area low-thickness silver films. After sintering, the thickness of the silver layer is thin ≧4μm and uniform, and the film surface is complete and without holes.
Exposure and development
Suitable for dry or wet lamination method.
Good fluidity and smooth ink film surface.
Applicable to dried silver film thickness ≦20μm, applicable light source 365~405nm.
Line width/line space resolution can reach 15μm/15μm.
The dry build-up process maintains good square shape after lamination
There is no silver residue between the lines, and the silver line film surface is smooth and flat without burrs.
The paste can be customized according to the required silver film thickness, line width and exposure conditions.
Hole-filling Silver paste
Application
For co-fired ceramic components such as LTCC, silver glue is filled into holes of various sizes to connect internal circuits between different green sheets.
Manufacturing process (solvent type screen printing)
Good fluidity and easy to print.
Applicable hole diameter 50~200μm, green sheet thickness 45μm or more.
The shrinkage is well matched and there will be no protruded or depressed hole pillars after sintering.
Excellent resistance to high humidity and high temperature.
Outer terminal paste
Application-1
High-temperature sintering silver connects the inner silver to the external circuit at the outer end of the component. It has good soldering ability and resists corrosion from acid liquid during plating process.
Advantage
High-temperature sintering silver paste is suitable for high-temperature co-firing component manufacturing processes to improve the heat resistance of components and provide components with stable quality characteristics in high-temperature operation applications.
Excellent resistance to high humidity and high temperature.
Easy to apply and stable quality.
Process method (dip coating, roller coating, printing)
Applicable component sizes are 0201~2220.
After coating, the film surface is smooth and even.
For R angles of any size, the silver film can be completely covered evenly and with sufficient thickness after sintering.
Resistant to acidic plating solutions and will not fall off after plating.
Application-2
Low-temperature outer terminal silver connects the inner silver to the external circuit at the outer end of the component. One dose of low-temperature outer terminal silver is easy to operate, has stable quality, and can be stored at room temperature.
Advantage
Low-temperature silver paste does not require a sintering process and has high conductivity characteristics. The special formula has excellent adhesion and is resistant to plating acid, making the product quality more stable.
Excellent resistance to high humidity and high temperature.
Easy to apply and stable quality.
Manufacturing process (dip coating, roller coating, screen printing)
Applicable component sizes are 0201~2220.
After coating, the film surface is smooth and even.
For R angles of any size, the silver film can be completely covered evenly and with sufficient thickness after sintering.
Resistant to acidic plating solutions and will not fall off after plating.
It can be stored at room temperature.
One-dose low-temperature silver colloid, easy to operate.
Marking Paste
Application
High-temperature sintering type marking paste, suitable for marking various characters, symbols, and cutting lines.
Advantage
The formula can be adjusted according to needs to suit various green sheet adhesion, shrinkage and color discrimination capabilities.
Manufacturing Process
Screen printing
Applicable to symbol text line width above 30μm.
Graphics such as symbols, text, etc. are smooth and even, clear and easy to identify.
Good adhesion and not easy to fall off.
Exposure and development
Suitable for dry or wet build-up process.
Good fluidity and smooth film surface.
Line width/line spacing resolution can reach 15μm/15μm.
Good identification and matching to green sheet.
Ceramic Paste
Application
Co-firing passive components by wet layer build-up method does not need the green sheet lamination process, which avoids impairing the component characteristics from internal silver deformation.
Advantage
It has good fluidity and is suitable for co-fired ceramic components by Wet layer build-up method. It is suitable for exposure and development processes of various ceramic film thicknesses after drying. It is suitable for light sources of 365~405nm and can complete graphics of any size without bottom burrs and undercut problems.
Manufacturing process(exposure and development)
Suitable for various line width, line spacing, or aperture requirements, high resolution.
The formula can be adjusted according to the characteristics of ceramic materials without causing burrs or undercutting problems.
The development process window is wide and there is no ceramic residue problem.
Packaging
Environmental Safety Standards
Does not contain ozone-depleting substances.
Complies with European EN 71 PART3:1994(A1:2000), which limits the content of eight heavy metals.
Comply with 2002/95/EC(RoHs), 83/264/EEC, 76/769/EEC.
Obtained Sony certification as a Green Partner.
Storage Conditions and Shelf Life
Store in a cool place, avoid contact with direct sunlight.
Please refer to each product specification for the storage conditions and effective use period of various products.
Exposure and development silver paste, ceramic paste, and marking paste must be stored at -15℃~-18℃.
Safety and Operating Instructions
Please refer to the Material Safety Data Sheet.
UV light-curing silver paste, exposure and development silver paste, ceramic paste, and marking paste must be used in a yellow light environment.
